We measure during the test the thermal properties of electronic circuits, materials and the complete system. We apply the process from modest to high temperature. Thermal tests shall be considered at the whole development cycle. Good engineering work can reduce heat on the components and finally in the whole system. Passive cooling not always possible even of professional components selection and thermal design engineering. The housing, airflow, heat spreader components shall be selected in consideration to avoid extra heat. The whole system must be tested under real temperature environments and wheatear conditions.
- thermal test (components, system)
- thermal engineering by circuit design and components selection
- passive components
- heat dissipation